triazine n.【化學】三嗪三氮雜萘。
n. 【化學】三嗪三氮雜萘。 “s-triazine“ 中文翻譯： 均三嗪“chlorguanide triazine“ 中文翻譯： 氯胍三嗪“isopropylamino-s-triazine“ 中文翻譯： 敵草凈“sym-triazine“ 中文翻譯： 均三嗪“symmetrical triazine“ 中文翻譯： 均三氮雜苯“triazine herbicide“ 中文翻譯： 三嗪類滅草劑“triazine herbicides“ 中文翻譯： 三氮苯除草劑“triazine resin“ 中文翻譯： 三嗪系樹脂“triazine resins“ 中文翻譯： 三氮“triazine ring“ 中文翻譯： 三嗪環“triazine triol“ 中文翻譯： 三聚氰酸“tripyridgl-s-triazine“ 中文翻譯： 三吡啶基均三嗪“amino sym triazine“ 中文翻譯： 氨基對稱三嗪“bismaleimide-triazine resin“ 中文翻譯： 雙馬來酰亞胺三嗪樹脂“dichloro-chloroaniline-triazine“ 中文翻譯： 二氯-氯苯胺-三嗪“ethyl triazine resin“ 中文翻譯： 乙基三嗪樹脂“ethylene urea triazine precondensate“ 中文翻譯： 乙烯脲三嗪預縮物“fluorinated triazine rubber“ 中文翻譯： 三嗪氟橡膠“perfluoro alkyl triazine polymer“ 中文翻譯： 全氟烷基三嗪聚合物橡膠“2,4,6-triamino-s-triazine“ 中文翻譯： 蜜胺“cyclic urea triazine formaldehyde resin“ 中文翻譯： 環脲三嗪甲醛樹脂“triazinate“ 中文翻譯： 三嗪苯酰胺“triazenyl“ 中文翻譯： 三氮烯基“triazene compounds“ 中文翻譯： 三氮烯化合物“triazene“ 中文翻譯： 三氮烯“triazanetrityl“ 中文翻譯： 三氮烷三基
triazole |
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Materials for interconnection structures - sectional specification set for reinforced base materials , clad and unclad - reinforced base materials clad and unclad - bismaleimide triazine , modified epoxide or unmodified , woven e - glass reinforced laminated sheets of defined flammability vertical burning test , copper - clad 互連結構用材料.包被和非包被增強基材分規范.包被和非包被增強基材.規定了易燃性的包銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編織e型玻璃纖維增強層壓板 |
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The influence of catalyst on the copolymerization of epoxy and cyanate was investigated , and the mechanism of their copolymerization was discussed . the catalyst can obviously accelerate the curing of the resin to decrease the curing temperature . the three kinds of reactions ( cyclotrimerization , co - reaction and polyetherification ) in their copolymerization are not simultneous and independent to each other . in the lack of cyanate functional group , the main structures are oxazoine and polyether structure in the cured resin , and the triazine ring structure is of miner importance 研究了催化劑對環氧樹脂與氰酸酯樹脂的共聚固化反應行為的影響，并初步探索氰酸酯/環氧固化的反應歷程.研究表明，催化劑能明顯地促進其固化反應，降低固化溫度，縮短固化時間；氰酸酯與環氧共聚反應歷程是首先氰酸酯三聚反應生成三嗪環結構，然后三嗪環開環與環氧共聚反應，最后是未能參與共聚反應的環氧官能團在唑啉結構和三嗪環的催化下發生聚醚化反應；在氰酸酯官能團欠量的條件下，固化樹脂中主要是唑啉和聚醚結構，而三嗪環結構的含量很少 |
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Materials for printed boards and other interconnecting structures - part 2 - 9 : reinforced base materials clad and unclad ; bismaleimide triazine modified epoxide or unmodified , woven e - glass reinforced laminated sheets of defined flammability vertical burning test , copper - clad 印制板和其它互連結構用材料.第2 - 9部分:包被和非包被增強基材.規定了易燃性的包銅二順丁烯二酰亞胺三嗪改良或未改良的環氧編織e型玻璃纖維增強層壓板 |
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Materials for printed boards and other interconnecting structures - part 2 - 9 : reinforced base materials clad and unclad - bismaleimide triazine , modified epoxide or unmodified , woven e - glass reinforced laminated sheets of defined flammability vertical burning test , copper - clad 印制板和其它互連結構用材料.第2 - 9部分:包被和非包被增強基材.阻燃型銅包被的雙馬來酰亞胺三嗪改良環氧化物或非改良紡織e型玻璃纖維增強層壓板 |
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Base materials for printed circuits . part 2 : specifications . specification number 19 : thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 印刷電路用基材.第2部分:規范. 19號規范:多層印刷板制作用的規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓薄板 |
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Bismaleimide base materials for printed circuits ; part 2 : specifications ; specification 19 : thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 印制電路用基材.第2部分:規范.第19號規范:制造多層印制板用的規定可燃性能的薄比斯瑪勒米德 |
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. 3 base materials for printed circuits - part 2 : specifications ; specification no . 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 3 印制電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰亞胺三氮雜苯改良式環氧編織玻璃布銅覆層壓板 |
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. 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1 印制電路用基材.第2部分:規范.第18號規范:規定易燃性的雙對馬來酰壓胺三氮雜苯改良型環氧玻璃纖維編織覆銅層壓板 |
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Base materials for printed circuits . part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test 印刷電路用基材.第2部分:規范. 18號規范.規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板 |
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Base materials for printed circuits . part 2 : specifications . specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test 印刷電路用基材.第2部分:規范. 18號規范:規定易燃性的雙馬來酰亞胺三嗪改良型環氧化合物機織玻璃纖維織物包銅層壓板 |
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Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 印制電路用基體材料.用于多層印制板構成的限定可燃性的薄雙馬來酰亞胺三嗪改性的環氧織物玻璃纖維包銅層壓板 |
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Specifications . specification no . 19 . thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 規范.第19號規范:多層印制電路板構件規定的可燃性雙馬來酰亞胺三嗪改型氧化物玻璃纖維編織包銅疊層板材 |
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Bismaleimide base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test 印制電路用基材.第2部分:規范.第18號規范:規定易燃性的比斯瑪勒米德 |
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Bismaleimide specifications - specification no . 19 - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards 規范.第19號規范.制造多層印制板用的規定可燃性能的薄比斯瑪勒米德 |
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Prepreg for multilayer printed wiring boards - bismaleimide triazine epoxide resin - impregnated glass cloth 多層印制線路板用半固化片. bismaleimide三氮雜苯環氧樹脂浸漬玻璃布 |
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S - triazine pesticides are rapidly becoming of increasing importance to agriculture S -三氮朵苯農藥對農業生產變得越來越重要。 |
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Bismaleimide triazine epoxide woven glass fabric copper - clad lamimates 雙馬來酰亞胺三嗪環氧玻璃布覆銅箔板 |