T - tlp 中文

tlp TLP ＝transient lunar phenome...

tm
Copper has been deposited on surface of the al mmcs as interlayer by magnetron sputtering , tlp bonding of al mmcs with these interlays , the joints shear strength of tlp bonding using deposited film was as much as the joint shear strength of tlp bonding using cu foil . removing the oxidation on the surface before deposition , copper was coated by magnetron sputtering as tlp bonding interlayer 待連接表面通過磁控濺射法沉積銅膜作為中間層進行瞬間液相連接，得到的接頭強度與銅箔中間層進行瞬間液相連接得到的接頭強度相當，而使用磁控濺射法去除待連接表面氧化膜后沉積銅膜作為中間層進行瞬間液相連接的接頭強度提高7 . 6左右。
This paper done deepgoing theoretical studies on the nonlinear dynamical analysis of tension leg platform ( tlp ) in waves based on reasonable mathematical model , revealed some important phenomenon , and gave out integral analysis theories and computational method . the main parts of the paper are as follows : 1 本文針對深海張力腿平臺本體在波浪作用下的非線性動力分析問題進行了深入的理論研究，建立了合理的數學模型描述了相關的問題，揭示了一些重要現象，提出了完整的張力腿平臺本體非線性動力分析理論和計算方法。
Effects of parameters ( pressure , temperature , holding time ) of tlp bonding of al mmcs on the joint shear strength have been studied . experimental and theoretical basis for joint with excellent mechanical properties have been provided 研究了瞬間液相連接時，壓力、連接溫度、保溫時間等工藝參數對接頭組織和性能的影響規律，為能實現碳化硅顆粒增強鋁基復合材料的良好連接打下理論基礎并提供實驗依據。
The particle segregation in the joint region has n ' t been observed when tlp bonding of al mmcs using 10 m thickness copper foil , according with the theory of z . li . the effect of joint property is the oxidation on surface of the ai mmcs Li等人在研究瞬間液相連接鋁基復合材料的接頭顆粒偏聚現象和機械性能時指出，采用合適的中間層厚度可以有效防止接頭區域顆粒偏聚現象。
It shows that with increasing the bonding temperature and the holding time , a denser and more homogeneous microstructure consisting of less amount of pores are obtained , thereby leading to an increase in the tensile strength . an increase in 通過斷口分析,認為w與cu合金的tlp連接實質是:與母材cu連接是cu 、 mn互擴散而形成的tlp連接;與母材w連接是cu - mn合金潤濕w的釬焊連接。
Tungsten and graphite , which have high melting point , can be used as thermal resistance materials , while copper and copper alloys , which have high thermal conductivity , can be used as cooling material 鎢、石墨均具有高熔點,可作為耐高溫材料;銅合金具有良好的導熱性,可作為冷卻材料。本文對w與cu合金tlp連接及石墨表面鈦金屬化進行了研究。
You can also lower your overall software costs with the upgrade plan because it contributes to the points accumulated in the tlp and clp , increasing the discounts made available to you under these programs 另外,通過升級計劃您能夠降低總體軟件成本,因為升級計劃支持tlp和clp中累積的積分,從而可提高根據這些計劃您可以享有的折扣級別。
6 . it also studied general variation regularities of wave force , added mass and added damping , tlp ' s kinetic respondence based on engineering examples and got some valuable conclusions ( see text ) 6 .基于工程實例，分別研究了tlp波浪力、附加質量與附加阻尼、 tlp的動力響應的一般規律，得到了一些富有工程意義的結論（詳見正文）。
The process of transient liquid phase ( tlp ) bonding of 6061a1 mmcs using 10urn thickness copper foil has been studied . by the experiment , the best technology parameters for the tlp bonding have been obtained 本文選擇10 m的銅箔作為中間層，進行鋁基復合材料的瞬間液相連接，通過試驗確定了獲得良好接頭的最佳工藝參數。
3 . it studied the radiation problem of tlp , and paid attention to the computation of added mass and added damping about tlp which cylinders are set as regular polygon 3 .研究了張力腿平臺的輻射問題，重點研究了浮筒柱正多邊形分布情況下，總體輻射附加質量和阻尼系數計算問題。
Inlaid target sputtering to remove oxide scale on surface of al mmcs at first , then another copper target sputtering , copper film was deposited on the inlaid target 研究了磁控濺射法在待連接表面沉積中間層的工藝參數以及不同的中間層制備方法對tlp連接接頭組織和性能的影響。
Crotts says improved tlp maps are already pointing to intriguing features on the lunar surface , and he is currently preparing a separate article on that subject 克勞斯說， “暫時月球光亮現象”已經成為了月球表面很有代表性的現象，目前他正在就這一命題準備發表文章。
When tlp bonding with pressure can avoid the effect of oxidation , obtain excellent joint property . oxidation was n ' t observed in the joint region by microanalysis 另外，研究表明，氧化膜在無壓瞬間液相連接時成為影響接頭性能的主要因素。
When tlp bonding with proper pressure , the oxidation on the surface of al mmcs was n ' t the primary effect of the properties of the joint 采用適當的壓力進行瞬間液相連接時，鋁基復合材料表面的氧化膜已不是影響接頭性能的主要因素。
Tlp pluggable terminal block the tlp series suits industrial and the industry control and the information industry use 系列為插拔式端子臺，采用高信賴接線結構及專業化的生產模式，品質安定，適合產業和工業控制與資訊產業使用。
Participation in the upgrade plan contributes to the points accumulated in the tlp and clp , which helps increase the overall discounts earned 只要參加升級計劃就可以增加tlp和clp的積分,從而提高獲得的整體折扣級別。
This thesis begins with a description of how tlp came into being , and then briefly introduces several architectures using tlp 研究多線程處理器的功耗仿真工具可以對多線程處理器的低功耗設計起到指導作用。
2 . it simplified the tlp as vertical floating arrays , did some work about second - order nonlinear diffraction wave force on tlp 2 .將結構簡化為直立浮筒柱群，研究了平臺本體上波浪的二階非線性繞射問題。
5 . the writer made three computation programs for wave force , added mass and added damping , tlp ' s kinetic respondence 5 .編制了三套程序，可分別用于波浪力、附加質量與附加阻尼、 tlp的動力響應計算。

名稱
說明
信箱
電話
圖片	移動背景圖固定背景圖重製上傳圖片

tlp

tlp TLP ＝transient lunar phenome...

tm

When tlp bonding with pressure can avoid the effect of oxidation , obtain excellent joint property . oxidation was n ' t observed in the joint region by microanalysis 另外，研究表明，氧化膜在無壓瞬間液相連接時成為影響接頭性能的主要因素。

When tlp bonding with proper pressure , the oxidation on the surface of al mmcs was n ' t the primary effect of the properties of the joint 采用適當的壓力進行瞬間液相連接時，鋁基復合材料表面的氧化膜已不是影響接頭性能的主要因素。

Tlp pluggable terminal block the tlp series suits industrial and the industry control and the information industry use 系列為插拔式端子臺，采用高信賴接線結構及專業化的生產模式，品質安定，適合產業和工業控制與資訊產業使用。

Participation in the upgrade plan contributes to the points accumulated in the tlp and clp , which helps increase the overall discounts earned 只要參加升級計劃就可以增加tlp和clp的積分,從而提高獲得的整體折扣級別。

This thesis begins with a description of how tlp came into being , and then briefly introduces several architectures using tlp 研究多線程處理器的功耗仿真工具可以對多線程處理器的低功耗設計起到指導作用。

2 . it simplified the tlp as vertical floating arrays , did some work about second - order nonlinear diffraction wave force on tlp 2 .將結構簡化為直立浮筒柱群，研究了平臺本體上波浪的二階非線性繞射問題。

5 . the writer made three computation programs for wave force , added mass and added damping , tlp ' s kinetic respondence 5 .編制了三套程序，可分別用于波浪力、附加質量與附加阻尼、 tlp的動力響應計算。