F - flip chip 中文

flip chip 【計算機】叩焊，(反裝)晶片，倒裝片(法)。

【計算機】叩焊，(反裝)晶片，倒裝片(法)。 “flip“ 中文翻譯： adj. (flipper, flippest) 〔美俚 ...“chip“ 中文翻譯： n. (摔跤時)用絆腿把對方摔倒的一種技巧。 vt. ( ...“flip-chip“ 中文翻譯：觸發器雙穩態多諧振蕩器; 彈拋片; 倒裝法; 倒裝片; 倒裝式芯片; 后滾翻“flip chip approach“ 中文翻譯：倒裝法“flip chip bonding“ 中文翻譯：倒裝焊接; 倒裝片接合“flip chip bump“ 中文翻譯：倒裝片[焊接]凸點，倒裝片對準點; 倒裝芯片隆起焊盤“flip chip carrier“ 中文翻譯：倒裝芯片座“flip chip integrated circuit“ 中文翻譯：倒裝片集成電路; 倒裝芯片集成電路“flip chip led“ 中文翻譯：制備出具有適合共晶焊接電極的大“flip chip method“ 中文翻譯：倒裝法“flip chip package“ 中文翻譯：晶構裝“flip chip substrate“ 中文翻譯：覆晶載板“flip chip transistor“ 中文翻譯：倒裝片式晶體管“flip chip ultrasonic bonder“ 中文翻譯：倒裝超聲焊接器“flip chip-pbga“ 中文翻譯：晶球柵陣列構裝技術“flip-chip bonder“ 中文翻譯：倒裝焊接器; 倒裝式焊接器“flip-chip bonding“ 中文翻譯：倒裝焊接倒扣芯片焊接; 叩焊“flip-chip integrated circuit“ 中文翻譯：倒裝片集成電路“flip-chip method“ 中文翻譯：倒裝焊接法“flip-chip transistor“ 中文翻譯：倒裝片式晶體管“flip-chip ultrasonic bonder“ 中文翻譯：倒裝超聲焊接器“hydraulic lift flip-chip“ 中文翻譯：液壓頂升倒裝法“flip“ 中文翻譯： vi. (-pp-) 1.用指頭彈；輕輕打。 2.(用鞭子等)抽。 3.叭嗒叭嗒地動；翻動紙張。 4.跳上車。 5.起強烈反應。 6.〔美俚〕失去自制力；入迷；精神失常，發瘋。 flip at an ass with a whip 用鞭子抽驢子。 vt. 1.用指輕彈，輕擊。 2.(用鞭)抽打；急速揮動(扇子等)；急拉(魚餌)。 3.翻動(紙牌等)。 4.跳上(行駛中的車輛)。 flip the ash from one's cigarette 彈去煙頭上的灰。 flip the pigskin 〔美國〕(足球)遞球。 flip up 擲錢幣(按正反面決定事)。 n. 1.拋，彈；輕打。 2.〔口語〕(短距離)飛行[傳球]。 3.筋斗。 n. -per 〔俚語〕炒股高手。 n. (加有香料的)飲料酒〔如啤酒、葡萄酒、蘋果酒等〕。 adj. (flipper, flippest) 〔美俚〕＝ flippant. “chip“ 中文翻譯： n. 1.碎片，削片，薄片；碎屑；薄木片；無價值的東西。 2.(陶器等的)缺損(處)。 3.(賭博用)籌碼；〔pl.〕〔英俚〕錢。 4.〔pl.〕〔口語〕炸馬鈴薯片。 5.(作燃料的)干牛[馬]糞。 6.集成電路唱片[塊]。 7.〔口語〕小粒金剛石[水晶]。 a chip of [off] the old block (脾氣等)完全像父親的兒子；一家的典型人物。 (as) dry as a chip 枯燥無味的。 buy chips 投資。 cash [pass] in one's chips 把籌碼兌現；〔俚語〕死。 chip in porridge [pottage, broth] 無關重要的東西，可有可無的東西。 do not care a chip for 毫不介意。 have a chip on one's shoulder 〔美俚〕盛氣凌人；好打架；好爭吵。 have one's chips on 孤注一擲。 in the chips 〔美俚〕有錢的。 let the chips fall where they may 不管后果如何。 when the chips are down [get on the line] 萬不得已的時候，緊急時候。 vt. (-pp-) 1.切，削，鑿，刻。 2.把…削成薄片；弄缺(刀口，瓷器等)。 3.〔口語〕戲弄；挖苦。 4.(雞雛等)啄碎(蛋殼)。 vi. 1.出現缺口。 2.碎裂，瓦解，破碎 (off)。 chip at 對準…打，謾罵。 chip in 〔口語〕插嘴，加入(打架等)；捐助；拿錢賭 (They all chipped in to buy it. 大家都要買了)。 chip off 切下來，削下來。 n. (摔跤時)用絆腿把對方摔倒的一種技巧。 vt. (-pp-) (用絆腿)摔倒(對方)。 “chip at“ 中文翻譯：拿取笑

flip phone
An automatic flip chip bonder is a precision instrument used to align and bond one or more dies onto a substrate in semiconductor industry . it develops for the mass production of ic , mems and moems with small feature sizes and high precise bonding demands . an alignment system is one of the key components in flip chip bonders 全自動倒裝貼片機( flipchipbonder )是半導體生產工藝中完成芯片和基底對準、鍵合的高精度自動化設備,適合于特征尺寸小,鍵合精度要求高的ic ( integratedcircuit ) 、 mems ( microelectromechanicalsystem ) 、 moems ( microopticalelectromechanicalsystems )等的大規模生產。
According to the m1l - std - 883c standard of thermal cycle loading , the delamination propagation rates at the interface between chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for two types of flip chip packages with different states of solder joint 采用mil - std - 883c標準，通過溫度循環實驗，使用高頻超聲顯微鏡( c - sam )無損檢測技術，測量了在不同焊點狀態下， b型和d型兩種實際倒裝焊封裝芯片與底充膠界面分層裂縫傳播速率。
In this thesis , the work on automatic alignment system is as follows : firstly , after the methods and optical systems for alignment whose are used commonly now are discussed , a new die leveling method based on auto - focus is presented for the flip chip bonder . auto - focus is completed by estimating from images ; die leveling is completed by focusing for several feature locations 本文針對倒裝貼片機的自動對準系統開展了以下幾方面的工作:首先在討論了現有的對準方法和自動貼片機的對準光路系統基礎上,針對貼片機實際應用環境,提出基于多點自動對焦的芯片調平方法。
The flip chip technology developed recently provides the shortest possible leads , lowest inductance , highest frequency , best noise control , highest packaging density , greatest number of inputs / outputs ( i / 0 ' s ) and lowest profile when compared with other popular interconnect technologies 新近發展起來的電子封裝倒裝焊技術，具有封裝密度高、信號處理速度快、寄生電容/電感小等優點，是目前最具發展前景的先進封裝技術之一。
Then , the half - empirical paris equation , which can be used as a design base of flip chip package reliability , have been determined from the crack propagation rates da / dn measured and the energy release rates g simulated 然后由實驗測得界面裂縫擴展速率和有限元模擬給出的能量釋放率，擬合得到可作為倒裝焊封裝可靠性設計依據的paris半經驗方程。
To our knowledge , for real flip chip packaging under the thermal loading , the paris equation obtained from experiment da / dn and simulation g is firstly reported here , and will be useful practically 本文在熱循環加載條件下對實際倒裝焊封裝給出實驗da / dn和模擬g關系的paris方程，屬首次報導。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages 集成電路倒裝芯片封裝中半導體芯片及載體之間形成可靠聯接所用焊料中的鉛。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages 完成某集成電路封裝（叩焊芯片）內部實際的電氣連接的焊料中的鉛。
The reliability of flip chip package was studied in this work by both experimental measurements and finite element simulations 本文針對倒裝焊封裝可靠性問題進行了實驗和數值模擬兩方面的研究。
The report of determination for interface delamination propagation rate of real flip chip packages is hardly found up to now 目前，測定實際倒裝焊封裝界面分層傳播速率報道尚少見。
As an electric current passes through , the joule heating and electromigration effects occur in the flip chip solder bumps 當電流通過焊點時，會伴隨產生焦耳熱效應和電遷移效應。
Promote the manufacture of high value - added products , e . g . wafer fabrication , flip chip technology -增加了高附加值產品的生產，如無線電晶片、芯片等
The current crowding effect and temperature distributions in flip chip solders are discussed 本研究亦討論在覆晶焊點中之電流聚集效應及其溫度分布。
Flip chip technology has become one of the major joining technologies in electronic packaging 摘要覆晶技術已成為電子構裝中之主要接合技術之一。
Current research on the reaction between solder bump and under bump metallurgy systems in flip chip 倒裝芯片中凸點與凸點下金屬層反應的研究現狀
Ic and optoelectronics packaging ; flip chip technology ; surface mount technology 集成電路及光電子封裝；倒扣芯片技術；表面貼裝技術
Air lift flip chip 氣頂升倒裝法
Flip chip underfill technology 的芯片倒裝技術
Fcpga flip chip pin grid array 反轉芯片針腳柵格陣列

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flip chip

flip chip 【計算機】叩焊，(反裝)晶片，倒裝片(法)。

flip phone

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages 集成電路倒裝芯片封裝中半導體芯片及載體之間形成可靠聯接所用焊料中的鉛。

Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages 完成某集成電路封裝（叩焊芯片）內部實際的電氣連接的焊料中的鉛。

The reliability of flip chip package was studied in this work by both experimental measurements and finite element simulations 本文針對倒裝焊封裝可靠性問題進行了實驗和數值模擬兩方面的研究。

The report of determination for interface delamination propagation rate of real flip chip packages is hardly found up to now 目前，測定實際倒裝焊封裝界面分層傳播速率報道尚少見。

As an electric current passes through , the joule heating and electromigration effects occur in the flip chip solder bumps 當電流通過焊點時，會伴隨產生焦耳熱效應和電遷移效應。

Promote the manufacture of high value - added products , e . g . wafer fabrication , flip chip technology -增加了高附加值產品的生產，如無線電晶片、芯片等

The current crowding effect and temperature distributions in flip chip solders are discussed 本研究亦討論在覆晶焊點中之電流聚集效應及其溫度分布。

Flip chip technology has become one of the major joining technologies in electronic packaging 摘要覆晶技術已成為電子構裝中之主要接合技術之一。

Current research on the reaction between solder bump and under bump metallurgy systems in flip chip 倒裝芯片中凸點與凸點下金屬層反應的研究現狀

Ic and optoelectronics packaging ; flip chip technology ; surface mount technology 集成電路及光電子封裝；倒扣芯片技術；表面貼裝技術

Air lift flip chip 氣頂升倒裝法

Flip chip underfill technology 的芯片倒裝技術

Fcpga flip chip pin grid array 反轉芯片針腳柵格陣列